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Buried Blind Microvia Hole Board
The most obvious different between the manufacture of the buried via hole or blind via hole multiplayer and a conventional bonded and through-hole placed board is that the buried via holes or blind via holes must be drilled and through-plated prior to bonding.
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| * Layer |
4-10 |
| * Base Matterial |
FR-4 |
| * Thickness |
0.8-3.2 |
| * Trace width & spacing |
0.10-0.15 |
| * Min. hole size |
0.25 |
| * Surface treatment |
HASL, Gold Plating, Organic Coating |
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| * PCMCIA Card |
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| * ID Card |
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| * Credit Card |
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| * VCR |
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| * Cellular Phones |
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