Technology »

Research & Developmnet

• Improved Signal Integrity and "Noise" reduction using "Via in Pad," Thermount, Mixed Dielectrics and Various other techniques
• 0.5mm pitch BGA capability
• Rigid Flex
• RAMBUS Module
• Variations of Micro Via Structures (cf. Micro Via Presentation)
• Lead Free replacements
• Halogen Free Laminates
• Buried Resistors
• Buried Capacitance
• 3 mil line width & space for Outer Layer Circuitry
• 10MHz Ceramic Teflon Boards for RF