| |
SILVER |
ENTEK |
ENIG |
HASL |
TIN |
ELECTROLYTIC Ni/Au |
| Planarity |
Planar |
Planar |
Planar |
Planar |
Planar |
Planar |
| Durability |
Low Shelf Life |
Low Shelf Life |
Durable |
Very Durable |
Durable |
Durable |
| Coating Thickness |
Consistent Silver Thickness |
Consistent ENTEK Thickness |
Consistent Ni/Au Thickness |
Inconsistent Solder Thickness |
Consistent TIN Thickness |
Inconsistent Ni/Au Thickness in comparison to ENIG |
| Press Fit Connectors Use |
Preferred |
Preferred |
Not Preferred |
Preferred |
Preferred |
Preferred |
| Industry Usage |
Lowest |
After ENIG |
After HASL |
Highest |
Lowest |
Lowest |
| Solderability |
Normal |
Good |
Excellent |
Excellent |
Normal |
Excellent |
| Multiple Rework Assembly Cycles |
Possible |
Not Possible |
Possible |
Possible |
Possible |
Possible |
| Cost |
Normal |
low |
Low |
High |
Normal |
Highest |
| Via Plugging |
No Possible |
No Possible |
Possible |
No Possible |
No Possible |
Possible |
| Reliability Concerns |
Handling & Surface Oxidation |
Handling & Shelf Life |
"Black Pad" |
|
Handling |
Silver & Throwing Power Inside Vias |
| ISU's Preference |
1 |
2 |
3 |
4 |
5 |
6 |
| |
| Other Disadvantages |
Surface Oxidation |
*Low Shelf Life |
*Higher Cost than HASL & ENTEK |
Non-Planar |
|
Highest cost than all other finishes |
| |
|
If process is not controlled properly "Black Pad" may be an end result |
|
PSR Adhesion Problem |
|
| Via Plugging is not reliable |
Via Plugging is not reliable |
|
|
Via Plugging is not reliable |
|
