| Item |
2003 |
2004 |
2005 |
| Minimum Line Width & Space |
I/L |
3 mil / 3 mil |
3 mil / 3 mil |
|
| O/L |
4 mil /4 mil |
4 mil / 4 mil |
3 mil / 3 mil |
| Smallest Mechanical Through Via Hole Size |
6 mil |
6 mil |
6 mil |
| Smallest Laser Micro Via Hole Size |
2 mil |
2 mil |
2 mil |
| Impedance: Single Ended & Differential |
High Vol. |
±10% |
±7% |
±5% |
| Ltd. Vol. |
±8% |
±7% |
±5% |
| Maximum Layer Count |
26+ |
30+ |
36+ |
| Finished Board thickness (in mil.) |
14-170 |
14-170 |
10-200 |
| Maximum Panel Size (in inch) |
10 x 24 |
20 x 24 |
20 x 24 |
| BGA / QFP Pitch (in mil.) |
32/16 |
31/15 |
31/14 |
| Pad Size (in mil.) |
Drill Size |
+9 |
+8 |
+6 |
| Minimum Dielectric Thickness (in mil.) |
2 |
1.6 |
1.6 |
| Surface Finish |
OSP, HASL, ENIG, Electrolytic Au., Immersion Ag., Tin |
Previous and other alternatives |
Previous and other alternatives |
| Aspect Ratio |
High Vol. |
12:1 |
14:1 |
15:1 |
| Ltd. Vol. |
2 |
1.6 |
1.6 |
| Conventional Blind & Buried Via's |
Yes |
Yes |
Yes |
| Micro Via's & Build-Up Tech. |
Yes |
Yes |
Yes |
| Material Types |
|
Tg=140 ºC, 170 ºC, 190 ºC, Epoxy, BT, Cyanate, Low Dk., Df. |
Previous and Ploymide |
Previous and Ploymide |
